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| BAL-2690D3U 50 / 30+j25 balun transformer for 2.45 GHz ISM band Features 50 nominal input / 30+j25 output differential impedance Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint: BAL-2690D3U < 1 mm Flip Chip 4 bumps Benefits Very low profile (<700 m) High RF performances RF BOM and area reduction GND Figure 1. Top view Top View Applications Balun transformer for applications such as: A2 A2 A1 A1 ZC ZC BAL - Bluetooth STLC2690 Mobile phone SE B2 B2 B1 B1 BAL + Description The BAL-2690D3U is a balun designed to www..com transform single ended signals to differential signals in Bluetooth applications. The BAL-2690D3U has been customized for the STLC2690 Bluetooth transceiver with 0.8 dB insertion losses in the bandwidth (2400 MHz - 2500 MHz) and with a specific requirement for the SCC22 parameter. The BAL-2690D3U has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performances. Bump Name Description A1 A2 B1 B2 BALGND BAL+ SE RF balanced ouput Ground RF balanced ouput RF input Figure 2. Application schematic WLAN PA + SP3T 2.4G Antenna Band Pass Filter BT Balun BT RFIC TM: IPAD is a trademark of STMicroelectronics. January 2010 Doc ID 16056 Rev 1 1/8 www.st.com 8 Electrical characteristics BAL-2690D3U 1 Electrical characteristics Table 1. Symbol PIN Input power RFIN ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5k , air discharge) ESD ratings, machine model (MM: C = 200 pF, R = 25 L = 500 nH) ESD ratings, charged device model (CDM) (JESD22-C101D) Operating temperature Absolute maximum ratings (limiting values) Test condition Min. 2000 500 500 -40 +85 C V Typ. Max. 20 Unit dBm VESD TOP Table 2. Symbol ZOUT ZIN Electrical characteristics (Tamb = 25 C) impedances Test condition Nominal differential output impedance Nominal input impedance Min. Typ. 30 + j25 50 Max. Unit Table 3. Symbol F IL ripple RL imb www..com RF performance Test condition Frequency range (bandwidth) Insertion loss in bandwidth Ripple in bandwidth Return loss in bandwidth Phase imbalance Amplitude imbalance Common mode rejection ratio (SSC12) Magnitude for common mode harmonic rejection coefficient @ 2fO Phase for common mode harmonic rejection coefficient @ 2fO From 4804 MHz to 4960 MHz, 25 is considered as reference for CM Min. 2402 14 -10 -1 20 0.7 Typ. 2441 0.8 Max. 2480 1.1 0.6 10 1 1 -45 0 Unit MHz dB dB dB dB dB Aimb RCMRR SCC22 2/8 Doc ID 16056 Rev 1 BAL-2690D3U Electrical characteristics Figure 3. - 0.9 Insertion loss (Tamb= 25 C) m2 m1 Figure 4. -10 Return loss (Tamb= 25 C) dB dB - 1.0 -15 Ripple in band 0.02 dB typ. - 1.1 -20 - 1.2 - 1.3 -25 F(Hz) - 1.4 2.2E9 2.3E9 2.4E9 2.5E9 2.6E9 -30 2.7E9 F(Hz) 2.3E9 2.4E9 2.5E9 2.6E9 2.7E9 2.2E9 Figure 5. 1.0 Amplitude imbalance (Tamb= 25 C) Figure 6. 10 Phase imbalance (Tamb= 25 C) dB 0.5 5 0.0 0.0 -0.5 -5 -1.0 2.2E9 2.3E9 2.4E9 2.5E9 2.6E9 F(Hz) 2.7E9 -10 2.2E9 2.3E9 2.4E9 2.5E9 2.6E9 F(Hz) 2.7E9 Figure 7. Scc22 magnitude @ 2f0 (Tamb = 25 C) Figure 8. Scc22 phase @2f0 (Tamb = 25 C) 1.0 0 - 10 www..com 0.9 - 20 - 30 0.8 - 40 0.7 4.6E9 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 F(Hz) 5.2E9 - 50 4.6E9 4.7E9 4.8E9 4.9E9 5.0E9 5.1E9 F(Hz) 5.2E9 Doc ID 16056 Rev 1 3/8 Electrical characteristics Figure 9. Recommend land pattern (used for balun characterization) BAL-2690D3U 35 m 76 m 18 m 540 m 18 m 76 m 35um L1 L2 L3 L4 No GND under the die in L1 GND under the die in L2 Figure 10. Example of transceiver application board land pattern www..com 4/8 Doc ID 16056 Rev 1 BAL-2690D3U Package information 2 Package information Epoxy meets UL94, V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 4. Package dimensions (values) Dimensions Ref. Min. A A1 A2 b D D1 E E1 SE $ 0.565 0.17 0.215 0.86 0.86 - Millimetres Typ. 0.63 0.205 0.4 0.255 0.91 0.474 0.91 0.474 0.237 0.025 Max. 0.695 0.24 0.295 0.96 0.96 Min. 0.022 0.007 0.008 0.034 0.034 - Inches Typ. 0.025 0.008 0.016 0.010 0.036 0.019 0.036 0.019 0.009 0.001 Max. 0.027 0.009 0.012 0.038 0.038 - Figure 11. Package dimensions (definitions) www..com b ZC B2 D B1 $ D1 Doc ID 16056 Rev 1 A A2 1 A SE E 1 A2 A1 E 5/8 Package information BAL-2690D3U Figure 12. Footprint Copper pad diameter: 220 m recommended Solder mask opening 300 m minimum Solder stencil opening: 220 m recommended Figure 13. Marking Dot, ST logo ECOPACK(R) Grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) xxz y ww Figure 14. Flip Chip - tape and reel specification Dot identifying pin A1 location 2.0 0.05 0.20 0.015 4.0 0.1 O 1.50 0.10 1.0 0.05 8.0 0.3 xxz y ww xxz y ww 1.0 0.05 0.73 0.05 2.0 0.05 All dimensions in mm User direction of unreeling Note: More packing information is available in the applications note: AN 2348: "Flip Chip: package description and recommendations for use" www..com 6/8 Doc ID 16056 Rev 1 xxz y ww 3.5 0.05 1.75 0.1 BAL-2690D3U Ordering information 3 Ordering information Table 5. Ordering information Marking RP Package Flip Chip Weight 1.02 mg Base qty 5000 Delivery mode Tape and reel Order code BAL-2690D3U 4 Revision history Table 6. Document revision history Date 25-Jan-2010 Revision 1 First issue. Changes www..com Doc ID 16056 Rev 1 7/8 BAL-2690D3U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. www..com Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8 Doc ID 16056 Rev 1 |
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